Advanced Interconnect Lead, Quantum AI

• Lead and manage our growing advanced interconnect technology team.
• Develop advanced integration and interconnect technologies for integrating cryogenic microwave devices and superconducting quantum components.
• Scope and purchase tools needed for development of integration technologies, including materials and processes, and determine the capabilities and limits of newly developed technologies.
• Collaborate with industrial and academic partners as a project technical lead for external technology development and implementation.
• Write documentation and transfer newly developed processes/technologies to in-house or external production.

Minimum qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
  
• 6 years of experience working with technology and process Research and Development (R&D) in Micro-electromechanical systems (MEMS), Printed Circuit Board (PCB), or silicon technologies.
• 3 years of experience in technical leadership.
  

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
  
• Experience with a scripting or a programming language.
  
• Experience with materials and integration technologies for electronics in extreme environments.
• Microwave engineering experience.

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
  
• 6 years of experience working with technology and process Research and Development (R&D) in Micro-electromechanical systems (MEMS), Printed Circuit Board (PCB), or silicon technologies.
• 3 years of experience in technical leadership.